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Agilent HSDL-3000 # 007/017 IrDA(R) Data Compliant 115.2 kbps Infrared Transceiver
Data Sheet
Description The HSDL-3000 is a small form factor infrared (IR) transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Physical Layer Specifications 1.3 and is IEC 825-Class 1 eye safe. The HSDL-3000 can be shut down completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for battery-operated handheld products. The HSDL-3000 has two front packaging type options (HSDL3000#007/017). Both options have an integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance. HSDL-3000 Ordering Information Part Number HSDL-3000#007 HSDL-3000#017
Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3000 infrared transceiver module. You can contact them through your local sales representatives for additional details.
Applications * Data communication - PDAs - Notebooks - Printers * Mobile telecom - Cellular phones - Pagers - Smart phones * Digital imaging - Digital cameras - Photo-imaging printers * Electronic wallet * Medical and industry data collection
Features * Fully compliant to IrDA 1.3 specifications: - 2.4 kbps to 115.2 kbps - Excellent nose-to-nose operation - Typical link distance > 1.5 m * Guaranteed temperature performance, -20 to 70 C - Critical parameters are guaranteed over temperature and supply voltages * Low power consumption - Low shutdown current (10 nA typical) - Complete shutdown for TXD, RXD, and PIN diode * Small module size - 2.70 x 9.10 x 3.65 mm (HxWxD) * Withstands >100 mVp-p power supply ripple typically * VCC supply 2.7 to 5.5 volts * LED stuck-high protection * IEC 825-Class 1 eye safe * Designed to accommodate light loss with cosmetic windows
Packaging Type Tape/Reel Strip
Package Front View Front View
Quantity 2500 10
Functional Block Diagram
VCC (5) CX2
Pinout
REAR VIEW
CX1
GND (6)
6
5
4
3
2
1
RXD (3)
HSDL-3xxx
SD (4) SHIELD
TXD (2)
TRANSMITTER
LEDA (1) R1 VCC
I/O Pins Configuration Table Pin Symbol 1 2 3 4 5 6 - LED A TXD RXD SD VCC GND SHIELD Description LED Anode Notes Tied through external resistor, R1, to regulated VCC from 2.7 to 5.5 volts.
Transmitter Data Input. Logic High turns on the LED. If held high longer than ~ 50 s, the LED is turned Active High. off. TXD must be either driven high or low. Do NOT float the pin. Receiver Data Output. Active Low. Shutdown. Active High. Supply Voltage Ground EMI Shield Output is a low pulse response when a light pulse is seen. Complete shutdown TXD, RXD, and PIN diode. Regulated, 2.7 to 5.5 volts. Connect to system ground. Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part.
Recommended Application Circuit Components Component R1 Recommended Value 2.2 5%, 0.25 Watt, for 2.7 VCC 3.3 V operation 2.7 5%, 0.25 Watt, for 3.0 VCC 3.6 V operation 6.8 5%, 0.25 Watt, for 4.5 VCC 5.5 V operation 0.47 F 20%, X7R Ceramic 6.8 F 20%, Tantalum Marking Information The HSDL-3000#007/017 is marked with a number "0" and "YWWLL" on the shield where `Y' indicates the unit's manufacturing year, `WW' refers to the work week and `LL' is the lot information.
CX1[1] CX2[2]
Notes: 1. CX1 must be placed within 0.7 cm of HSDL-3000 to obtain optimum noise immunity. 2. In environments with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in "HSDL-3000 Functional Block Diagram"on page 2.
Caution: The BiCMOS inherent to the design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken during handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
2
RECEIVER
Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50C/W. Parameter Storage Temperature Operating Temperature LED Supply Voltage Supply Voltage Output Voltage: RXD LED Current Pulse Amplitude Symbol TS TA VLED VCC VO ILED Min. -40 -20 0 0 -0.5 Max. 100 70 7 7 7 500 Units C C V V V mA 90 s Pulse Width 20% Duty Cycle Conditions
Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Logic Input Voltage for TXD Receiver Input Irradiance Logic High Logic Low Logic High Logic Low TXD Pulse Width (SIR) Receiver Data Rate Ambient Light Symbol TA VCC VIH VIL EIH EIL tTPW (SIR) 1.5 2.4 Min. -20 2.7 2/3 VCC 0 0.0036 Max. 70 5.5 VCC 1/3 VCC 500 0.3 1.6 115.2 Units C V V V mW/cm2 W/cm2 s kbps For in-band signals 115.2 kbps[1] For in-band signals[1] tPW (TXD) = 1.6 s at 115.2 kbps Conditions
See Test Methods on page 16 for details.
3
Electrical & Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25C with VCC set to 3.0 V unless otherwise noted. Parameter Receiver Viewing Angle Peak Sensitivity Wavelength RXD Output Voltage Logic High Logic Low RXD Pulse Width (SIR)[2] RXD Rise and Fall Times Receiver Latency Time[3] Receiver Wake Up Time[4] Transmitter Radiant Intensity Viewing Angle Peak Wavelength TXD Logic Levels High Low TXD Input Current High Low LED Current Shutdown Wakeup Time[5] Maximum Optical Pulse Width[6] TXD Rise and Fall Time (Optical) LED Anode on State Voltage IEH 21/2 p VIH VIL IH IL IVLED tTW tPW(Max) tr, tf VON (LEDA) -1 2/3 VCC 0 0.02 -0.02 20 30 25 44 30 875 VCC 1/3 VCC 1 1 1000 100 50 600 2.2 75 60 mW/sr nm V V A A NA ns s ns V ILEDA = 350 mA, VI (TXD) VIL VI VIH 0 VI VIL VI (SD) VIH, TA = 25C ILEDA = 350 mA, 1/2 15, TXD VIH, TA = 25C 21/2 p 30 875 nm Symbol Min. Typ. Max. Units Conditions
VOH VOL tRPW (SIR) tr, tf tL tRW
VCC -0.2 0 1 25 25 18
VCC 0.4 7.5 100 50 100
V V s ns s s
IOH = -200 A, EI 0.3 W/cm2 1/2 15, CL = 9 pF CL = 9 pF EI = 10 mW/cm2
4
Electrical & Optical Specifications (Continued) Parameter Transceiver Input Current High Low Supply Current Shutdown Idle Active IH IL ICC1 ICC2 ICC3 -1 0.01 -0.02 0.01 290 2 1 1 1 450 8 A A A A mA VI VIH 0 VI VIL VSD VCC - 0.5, TA = 25C VI(TXD) VIL, EI = 0 VI(TXD) VIL Symbol Min. Typ. Max. Units Conditions
Notes: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, p, is defined as 850 nm p 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 2. For in-band signals 2.4 kbps to 115.2 kbps where 3.6 W/cm2 EI 500 mW/cm2. 3. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity. 4. Receiver wake up time is measured from VCC power on to valid RXD output. 5. Transmitter wake up time is measured from VCC power on to valid light output in response to a TXD pulse. 6. Maximum optical pulse width is defined as the maximum time that the LED will remain on. This is to prevent the long turn on time for the LED.
500 2.2 470 2.7 440
ILED (mA)
ILED (mA)
500 470 440
IEH (mW/sr)
110 100 90 80 70 60 50 40 1.80 220 260 300 340 380 420 460 500 ILED (mA)
410 6.8 380 350 320 290 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 VCC (V)
410 380 350 320 290 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 VON (LEDA)
ILED vs. VCC.
ILED vs. VON (LEDA).
IEH vs. ILED.
5
HSDL-3000#007 and HSDL-3000#017 Package Outline with Dimension and Recommended PC Board Pad Layout
9.10 0.15
2.70 0.15 1.35
2.65 1.25
2.60 5.80 1.55
0.70
2.95
;;;;
1 2 3 4 5 6 PITCH 1.55 (5X) 0.65 (4 PLACES) RECOMMENDED LAND PATTERN 3.13 3.05 6 0.25 8.60 5 4 3 1.55 2 1
3.65
0.60 (2 PLACES) DIMENSIONS HEIGHT: 2.70 0.15 mm WIDTH: 9.10 0.15 mm DEPTH: 3.65 0.20 mm UNLESS OTHERWISE STATED, TOLERANCES 0.2 mm
0.425 0.55
1.10 0.50
2.30 1.20
0.85
6
HSDL-3000#007 and HSDL-3000#017 Tape and Reel Dimensions
4.00 0.10 5.00 (MAX.) POLARITY PIN 6: GND
123456
1.75 0.10 1.13 0.10
1.55 0.05
+
+0.10 3.46 0 +0.10 3.30 0
7.50 0.10 16.00 0.30
9.50 0.10
PIN 1: VLED 0.40 0.10 3.00 0.10 8.00 (MAX.) 8.00 0.10
MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE 3.40 0.20 4.20 0.20
PROGRESSIVE DIRECTION
(40 mm MIN.) EMPTY
PARTS MOUNTED
(40 mm MIN.) LEADER
EMPTY (40 mm MIN.) "B" "C" 330 80 UNIT: mm QUANTITY 2500
DETAIL A
DIA. 13.00 0.50 R 1.00 2.00 0.50
B
C
LABEL
21.00 0.80
16.40
+ 2.00 0
DETAIL A
2.00 0.50
7
Moisture Proof Packaging The HSDL-3000 is shipped in moisture proof packaging. Once opened, moisture absorption begins.
Recommended Storage Conditions Storage Temperature Relative Humidity 10C to 30C Below 60% RH
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. Baking If the parts are not stored in a dry environment, they must be baked before reflow process to prevent damage to parts. Baking should be done only once.
Packaging In Reel In Bulk
Baking Temperature 60C 100C 125C 150C
Baking Time 48 hours 4 hours 2 hours 1 hour
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Reflow Profile
230
T - TEMPERATURE - (C)
MAX. 245C R3 R4
200 183 170 150 125 100 R1
R2
90 sec. MAX. ABOVE 183C
R5
50 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300
t-TIME (SECONDS) P2 SOLDER PASTE DRY
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T 25C to 125C 125C to 170C 170C to 230C (245C max.) 230C to 170C 170C to 25C
Maximum T/time 4C/s 0.5C/s 4C/s -4C/s -3C/s
The reflow profile is a straight line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates. The T/time rates are detailed in the above table. The temperatures are measured at the component to printed-circuit board connections. In process zone P1, the PC board and HSDL-3000 castellation I/O pins are heated to a temperature of 125C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-3000 castellation I/O pins.
Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170C (338F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230C (446F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and
unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170C (338F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -3C per second maximum. This limitation is necessary to allow the PC board and HSDL-3000 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3000 transceiver.
9
Appendix A : HSDL-3000#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
STENCIL APERTURE
METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK PCBA
Figure 1. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3000
DIM. a b c (PITCH) d e f g h
mm 2.30 0.85 1.55 1.10 3.05 2.20 2.42 0.20
INCHES 0.091 0.034 0.061 0.043 0.120 0.087 0.095 0.008 b d e Rx LENS
SHIELD SOLDER PAD Tx LENS
g
Y
f h a theta
X
FIDUCIAL
6x PAD
c
FIDUCIAL
Figure 2. Top view of land pattern.
10
1.2 Adjacent Land Keep-out and Solder Mask Areas
Dim. h j k l
mm min. 0.40 10.1 3.85 3.2
Inches min. 0.016 0.40 0.15 0.126
j
Rx LENS
Tx LENS
* Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. * "h" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. * It is recommended that 2 fiducial cross be placed at midlength of the pads for unit alignment. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
k LAND h Y SOLDER MASK
X l
Figure 3. HSDL-3000#007/#017 PCBA - Adjacent land keep-out and solder mask.
2.0 Recommended Solder Paste/ Cream Volume for Castellation Joints The recommended printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume).
11
2.1 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used:
See Fig. 4. t, Nominal Stencil Thickness l, Length of Aperture mm inches mm inches 0.152 0.006 2.3 0.05 0.091 0.002 0.127 0.005 2.75 0.05 0.108 0.002 w, the width of aperture, is fixed at 0.85 mm (0.034 inches). Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land dimension.
APERTURES AS PER LAND DIMENSIONS
t (STENCIL THICKNESS)
SOLDER PASTE
w l
Figure 4. Solder paste stencil aperture.
12
Appendix B: HSDL-3000#007/#017 - Recommended Optical Port Design To insure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 degrees, the maximum, to a cone angle of 60 degrees. X is the width of the window, Y is the height of the window, and Z is the distance from the HSDL-3000 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens is 5.80 mm. The equations for the size of the window are as follows: X = 5.80 +2(Z + D) tan Y = 2(Z + D) tan Where is the required half angle for viewing. For the IrDA minimum, it is 15 degrees, for the IrDA maximum it is 30 degrees. (D is the depth of the LED image inside the part, 3.2 mm from the Tx lens vertex). These equations result in the following tables and graphs:
X
Z
Y
13
Minimum and Maximum Window Sizes Dimensions are in mm. Depth (Z) mm 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 X min. 7.34 7.88 8.42 8.95 9.49 10.02 10.56 11.10 11.63 12.17 12.70 13.24 13.77 14.31 14.85 15.38 15.92 16.46 16.99 17.53 18.06 Y min. 1.71 2.25 2.79 3.32 3.86 4.39 4.93 5.47 6.00 6.54 7.07 7.61 8.14 8.68 9.22 9.75 10.29 10.83 11.36 11.90 12.43 X max. 9.33 10.48 11.63 12.79 13.94 15.10 16.25 17.41 18.56 19.72 20.87 22.03 23.18 24.34 25.49 26.65 27.80 28.95 30.11 31.26 32.42 Y max. 3.70 4.85 6.00 7.16 8.31 9.47 10.62 11.78 12.93 14.09 15.24 16.40 17.55 18.71 19.86 21.01 22.17 23.32 24.48 25.63 26.79
18 16
WINDOW HEIGHT Y - mm
25
Y MAX.
WINDOW WIDTH X - mm
14 12 10 8 6 4 2 0 0 2 4 6 8 10 ACCEPTABLE RANGE Y MIN.
20
X MAX.
15 X MIN. 10
5 0
0
2
4
6
8
10
MODULE DEPTH Z - mm
MODULE DEPTH Z - mm
Window height Y vs. module depth Z.
Window width X vs. module depth Z.
14
Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical design reasons, place a curve on the back side of the window that has the same radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will reduce the effects. The amount of change in the radiation pattern is dependent upon the
material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm.
Flat Window (first choice)
Curved Front and Back (second choice)
Curved Front, Flat Back (do not use)
15
Test Methods Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC 61000-4-3 severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 W/cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radation is covered by the incandescent condition.
3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 W/cm2 minimum and 0.3 W/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area.
The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation.
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2001-2005 Agilent Technologies, Inc. Obsoletes 5988-3265EN November 23, 2005 5989-4164EN

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